As the demands for high power density in industrial power supplies, energy storage devices, and new energy transportation, the traditional MOSFET packaging technology is facing unprecedented challenges. Inmark’s TOLT top-heat-dissipated MOSFET, with its revolutionary heat dissipation design and power handling capabilities, has become a core solution for high-power scenarios. This device, specifically designed for large chips and high current applications, is redefining the application boundaries of power semiconductors with its three major advantages: fast heat dissipation, low loss, and high density.


Revolutionizing Top-Down Heat sink: Making High-Power Devices No Longer "Over-heat"
The core breakthrough of TOLT packaging lies in completely reconstructing the traditional bottom-down heat dissipation path "Junction→PCB" into "Junction→Top Heatsink." This design is like opening a "heat dissipation window" for the chip:
 
• Boosted Thermal Conductivity: Heat is directly conducted to the heatsink through the top TIM thermal interface, resulting in a 36% temperature reduction compared to TOLL packages and nearly double the thermal efficiency of traditional TO-220 through-hole packages.
 
• Power Density Freedom: Allows chips to operate in a higher temperature range. Combined with large-size chip designs, a single device is able to carry continuous currents exceeding 50A, even easily handling high-current scenarios such as charging piles and energy storage converters.
 
• PCB Design Liberation: Eliminates the reliance on PCB vias and copper foil for bottom heat dissipation. The rear of the circuit board can be freely arranged with driver circuitry, so as to increase power density by over 40%.

Five Key Technical Features: Core Support for High-Power Scenarios
 
▶ Kelvin Pin Design: The "Magic Key" to improve driving efficiency
Built-in independent Kelvin source pins are able to reduce parasitic inductance to below 1nH, decrease switching losses by 20% and achieve efficiency exceeding 99% in high-frequency inverter scenarios.
 
▶ 1mm Creepage Distance: A "Protective Wall" for High-Voltage Safety
A 1mm increased in creepage distance compared to JEDEC standards can make it easily to pass the 1500V withstand-voltage test, and meet safety requirements for high-voltage applications such as energy storage battery packs and industrial power supplies.

▶ Gull-wing Pins: “Guardian” of Process Reliability
The unique gull-wing structure increases the surface mount soldering area by 30%, improves vibration resistance by 5 times, and facilitates easy visualization and inspection of soldering joints, eliminates void issues and perfectly adapts to automated production lines.
 
▶ Clip Bonding Technology: “Booster” for Low Resistance and High Current
Internally, copper clips replace traditional gold wire bonding, in this way it can reduce RDS (ON) by 15% and temperature rise under high current by another 12%, making it particularly suitable for BMS double-sided mounting scenarios, with a 22% lower temperature than TOLL packages.
 
▶ Ultra-thin Design: “Promoter” of Space Revolution
With a thickness of only 1.2mm, it can be directly mounted on the device housing for heat dissipation, so as to replace traditional TO-220/247 through-hole components, achieve a 50% reduction in product thickness and free up more space for compact equipment such as electric forklifts and unmanned boats.
 
Full-Scenario Coverage: The "Power Heart" from Industry to New Energy
 
In the industrial field, TOLT-packaged MOSFET has become standard configuration for power supplies in AI server and communication base station. Its high reliability enable data centers to operate 24/7. In new energy transportation scenarios, from two-wheeled electric vehicles to yacht motor controllers, its low-loss characteristics extend the driving range by more than 15%. And in the battery BMS field, the double-sided mounting solution increases battery pack energy density by 20%, so as to become a key to cost reduction and efficiency improvement in energy storage systems.



Today, Inmark Electronics has achieved mass production of its full range of TOLT packages for low- and medium-voltage MOSFETs, Cool MOSFETs, and SiC MOSFETs, so as to provide one-stop services from design to mass production for the high-end industrial and new energy markets. When high-power applications meeting TOLT, a revolution in efficiency and space is unfolding – your next high-power solution may only be missing this "breathing" MOSFET.